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Person
ISNI: 
0000 0001 2421 0772
Name: 
Yin, C
Yin, Chunyan
Creation class: 
Text
Creation role: 
author
Related names: 
University of Greenwich
Titles: 
Effect of Reflow Process on the Contact Resistance and Reliability of Anisotropic Conductive Film Interconnection for Flip Chip on Flex Applications, The
Effect of Solder Reflow on the Reliability of Flip-Chip on Flex Interconnections using Anisotropic Conductive Adhesives
Effects of Solder Reflow on the Reliability of Flip-Chip on Flex Interconnections Using Anisotropic Conductive Adhesives
Experimental and modelling analysis on the performance of anisotropic conductive films as used in electronics packaging
Macro-Micro Modelling of Moisture Induced Stresses in an ACF Flip Chip Assembly
Notes: 
Sources: 
JNAM